Through the Line Podcast: Google's AI Vision Rethink of Package Testing for Shock & Vibes

How are new tools, in conjunction with AI, helping engineers at Google?

Jun 16, 2026

Packaging World Editor-in-Chief Matt Reynolds sits down with Ken Leung, Senior Mechanical Engineer at Google, to discuss high-speed imaging and AI-driven analysis for packaged data center hardware. Leung explains why traditional testing methods may be missing the point because of changes to the products they're meant to protect.

Follow this podcast on your favorite streaming platform - links can be found by clicking here.

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