Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.

University of Florida Awarded Packaging Scholarship

Winning the 2020 The Future Leaders in Packaging Scholarship from Packaging World and the PMMI Foundation was the University of Florida Packaging Engineering program.

Ifas2013

The Future Leaders in Packaging Scholarship from Packaging World and the PMMI Foundation was established in 2011 in conjunction with Leaders in Packaging—a print and online marketing program that enables suppliers to promote their innovations and expertise to the packaging community.

A portion of Leaders in Packaging revenue funds the $5000 Scholarship—awarded each year to an educational institution that prepares students for careers in packaging. Each recipient institution then selects a student or students to receive the funds to defray tuition and other education-related expenses in the next academic year. The 2020 scholarship was awarded to the University of Florida’s Packaging Engineering program, which is a true, multi-disciplinary engineering program, according to UF's Bruce A. Welt, Ph.D., Packaging Engineering Program Coordinator. 

Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
Download Now
Annual Outlook Report: Workforce
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
Download Now
List: Digitalization Companies From PACK EXPO