View news and innovations from PACK EXPO 2024
View all the latest news and innovations from PACK EXPO International 2024

University of Florida Awarded Packaging Scholarship

Winning the 2020 The Future Leaders in Packaging Scholarship from Packaging World and the PMMI Foundation was the University of Florida Packaging Engineering program.

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The Future Leaders in Packaging Scholarship from Packaging World and the PMMI Foundation was established in 2011 in conjunction with Leaders in Packaging—a print and online marketing program that enables suppliers to promote their innovations and expertise to the packaging community.

A portion of Leaders in Packaging revenue funds the $5000 Scholarship—awarded each year to an educational institution that prepares students for careers in packaging. Each recipient institution then selects a student or students to receive the funds to defray tuition and other education-related expenses in the next academic year. The 2020 scholarship was awarded to the University of Florida’s Packaging Engineering program, which is a true, multi-disciplinary engineering program, according to UF's Bruce A. Welt, Ph.D., Packaging Engineering Program Coordinator. 

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing