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BERHALTER Swiss Die-Cutting, a global expert in high-performance die-cutting technology, is excited to announce its participation in PACK EXPO Las Vegas 2025. This premier industry event will bring together top professionals in packaging and processing for three days of live demonstrations, technological innovations, and networking opportunities.
Agenda Highlights:
At Booth SU-37044, BERHALTER Swiss Die-Cutting will be showcasing its most advanced die-cutting solutions, offering live demonstrations and expert consultations. Key highlights include:
· Exclusive Live Demonstrations: Attendees will witness the power and precision of the BERHALTER Swiss Die-Cutter B6, capable of up to 500 strokes per minute. This cutting-edge machine sets new benchmarks for speed, efficiency, and accuracy in die-cutting.
· CUTcontrol™ IIoT Platform: Discover how the intelligent IIoT platform, CUTcontrol™, provides real-time data, enabling predictive maintenance and improving operational efficiency. Learn how this platform can streamline production lines and minimize downtime.
· Meet Our Experts: Dalibor Schuman, Reto Frei, and Gregory Frei will be available at our booth to provide insights into how our solutions can optimize your die-cutting processes, boost productivity, and reduce costs.
Why You Should Attend:
For professionals in packaging, die-cutting, and manufacturing, PACK EXPO is the perfect opportunity to discover the latest advancements in the industry. Attendees will benefit from:
· First Access to New Technologies: Get an exclusive look at the latest innovations in die-cutting, from high-speed cutting to digital platforms designed to maximize production efficiency.
· Personalized Consultations: Our team of experts will be on-site to offer tailored advice and solutions to meet your specific production challenges.
· Networking Opportunities: Connect with industry leaders, exchange ideas, and gain valuable insights into the trends shaping the future of the packaging and processing industries.
Quotes:
“We are looking forward to showcasing our cutting-edge solutions at PACK EXPO,” said Dalibor Schuman, Managing Director of BERHALTER Swiss Die-Cutting. “This event provides a fantastic platform for us to demonstrate how our technologies can help businesses improve efficiency, sustainability, and competitiveness in today’s fast-paced market.”
