Discover What’s Possible in Packaging & Processing, Oct. 18-21 in Chicago
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B&R Industrial Automation: New CPU board for PC platforms

B&R’s Automation PC 810 and Panel PC 800 devices come with a new CPU board with an Intel® CoreTM2 Duo P8400 processor.

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The combination of the 2.26 GHz Core2 Duo processor and the GM45 chipset provides high performance at an extremely attractive price, even for demanding applications such as vision systems. Both processor cores share a 3 MB level 2 cache, which allows efficient multitasking. The fast 1.066 MHz frontside bus is also combined with DDR3 RAM modules, thus rounding out the high-performance infrastructure of the entire system.
Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,600 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
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Discover How to Stay Ahead of the Competition at PACK EXPO International
Is your packaging line built for connected packaging?
RFID, QR codes, and 2D barcodes are reshaping CPG operations. See how leading brands are adapting.
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Is your packaging line built for connected packaging?