Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

EDI's new extrusion coating die reduces downtime

The innovation comes in an extensive upgrade of the deckle system, improves ease-of-use, repeatability of width adjustments, and also simplifies clean-out of polymer buildup.

Pw 3023 George Edi Ep Cdie
Extrusion Dies Industries LLC's (EDI) new generation of its EPC™ extrusion coating die, introduced at PACK EXPO, increases productivity by simplifying changes in product width and eliminating much of the deckle disassembly involved in cleaning and maintenance, the company says.

As in the past, the EPC die incorporates a deckle system that can be adjusted to minimize the formation of edge bead, which wastes polymer and substrate as it is trimmed from the web.

"What is innovative in the new-generation EPC die is an extensive enhancement of the deckle system that increases the ease and repeatability of width adjustments, simplifies clean-out of carbonized polymer buildup in the die, and makes possible rapid removal of the entire deckle assembly for a ‘split and clean,' or complete opening of the die for maintenance," explains Gary Oliver, vice president of technology and engineering.

Deckles are mounted at either end of a die and used for varying the coating width. The die includes an external deckle to prevent leakage and an internal deckle system with independently adjustable components that seal off portions of the internal flow channel and can be positioned to minimize edge bead.

The new-generation EPC die includes innovations that reduce time in four ways:
• Rapid and accurate changes in width.
• An easily inserted scraper to remove buildup.
• Ready access for replacing seals and adjusting die gap.
• Fast removal of deckle systems for "split and clean."
2024 PACK EXPO Innovations Reports
Exclusive access: Packaging World editor-curated reports revealing PACK EXPO's most groundbreaking technologies across food, healthcare, and machinery sectors. Each report features truly innovative solutions selected from hundreds of exhibitors by our expert team. Transform your operations with just one click.
Access Now
2024 PACK EXPO Innovations Reports
Is your palletizing solution leaving money on the floor?
Discover which palletizing technology—robotic, conventional, or hybrid—will maximize your packaging line efficiency while minimizing long-term costs in this comprehensive analysis.
Read More
Is your palletizing solution leaving money on the floor?