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Balluff: I/O and RFID connectivity for CC-Link

Balluff’s IP67 CC-Link I/O modules and supporting cordsets provide a full I/O and RFID connectivity solution for CC-Link, and enable the consistent, cost-optimized implementation of requirements using decentralized installation technology.

Pw 3068 Webballuff
The IP67 CC-Link I/O modules can be used to simplify the way most CC-Link I/O Networks are run by placing the modules near the concentration of sensors and actuators. The smaller footprint and ease of setup reduces installation material costs and labor, as well as decreases maintenance troubleshooting and repairs.  Product features include: I/O Module; unique push-button display allows for easy configuration right at the block;  IP67 rugged metal housing that withstands harsh industrial environments; ports that accept 2- or 3-wire inputs; cordsets and accessories; auxiliary power cordsets and more.
Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,600 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
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Discover How to Stay Ahead of the Competition at PACK EXPO International
Is your packaging line built for connected packaging?
RFID, QR codes, and 2D barcodes are reshaping CPG operations. See how leading brands are adapting.
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Is your packaging line built for connected packaging?