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Balluff: I/O and RFID connectivity for CC-Link

Balluff’s IP67 CC-Link I/O modules and supporting cordsets provide a full I/O and RFID connectivity solution for CC-Link, and enable the consistent, cost-optimized implementation of requirements using decentralized installation technology.

Pw 3068 Webballuff
The IP67 CC-Link I/O modules can be used to simplify the way most CC-Link I/O Networks are run by placing the modules near the concentration of sensors and actuators. The smaller footprint and ease of setup reduces installation material costs and labor, as well as decreases maintenance troubleshooting and repairs.  Product features include: I/O Module; unique push-button display allows for easy configuration right at the block;  IP67 rugged metal housing that withstands harsh industrial environments; ports that accept 2- or 3-wire inputs; cordsets and accessories; auxiliary power cordsets and more.
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
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List: Digitalization Companies From PACK EXPO
Annual Outlook Report: Sustainability
The road ahead for CPGs in 2025 and beyond—Packaging World editors review key findings from a survey of 88 brand owners, CPG, and FMCG readers.
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Annual Outlook Report: Sustainability