Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.

Beckhoff Automation: Embedded PC with Intel® Atom™

Beckhoff Automation’s CX5000 Embedded PC with Intel® Atom™ promotes energy-efficiency in a compact package with a 1.6 GHz processor.

Pw 3865 Webbeckhoff
The CX5000 is designed with a lightweight magnesium housing, offering improved mechanical stability and resistance to EMC. The powerful DIN rail-mountable PAC features a fanless design with a maximum power loss of 12.5 watts. The CX5010 is equipped with a 1.1 GHz Intel® Atom™ processor, while the CX5020 features a 1.6 GHz processor. Additional features include: lower hardware cost; reductions in utility costs; cabinet space reductions; and more.
Conveying Innovations Report
Editors report on distinguishing characteristics that define each new product and collected video demonstrating the equipment or materials as displayed at the show. This topical report, winnowed from nearly 300 PACK EXPO collective booth visits, represents a categorized, organized account of individual items that were selected based on whether they were deemed to be both new, and truly innovative, based on decades of combined editorial experience in experiencing and evaluating PACK EXPO products.
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Conveying Innovations Report
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
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List: Digitalization Companies From PACK EXPO