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Packaging Summit Expo and Conference coming to the U.S.

For the first time in more than a decade, the World Packaging Organisation (WPO) will hold its World Packaging Conference in the United States.

Pw 9147 Packaging Summit Horiz High

The event, and the WorldStar Package Awards Ceremony, will be held in conjunction with the Packaging Summit Expo and Conference May 15-17, 2007 at the Donald E. Stephens Convention Center in Rosemont, IL.

WPO's participation in the Packaging Summit furthers the organization's purpose, which is to encourage the development of packaging technology, science, and engineering, contribute to the development of international trade, and stimulate packaging education and training.

The Packaging Summit Expo and Conference is sponsored by the Institute of Packaging Professionals (IoPP), which will host both the IoPP AmeriStar Package Awards Reception May 15, and the WPO WorldStar Package Awards Ceremony the following evening.

“By hosting both IoPP's AmeriStar and WorldStar receptions, the Packaging Summit Expo and Conference represents a global gathering of packaging innovation and excellence,” says Tom Schneider, CPP, and IoPP past president and representative to WPO. “With an emphasis on package development through containers, materials, and contract packaging, these awards programs celebrate a world view of packaging,” he says. For more information about the Packaging Summit Expo and Conference, call 262/782-1900, or visit www.pkgsummit.com.

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