The 2021 Virtual ISTA Forum, including TransPack and TempPack will be held on Tuesday, March 30th and Wednesday, March 31st. (Premier sponsor spotlights will be held on Thursday, April 1st.)
The Forum program will offer a blend of presentations, thought-provoking group discussions and interactive networking to make the most of the virtual experience. The focused group discussions will offer attendees an opportunity to participate in an extended conversation around a shared theme or topic while discussion leaders introduce and facilitate the topics.
