See What’s Possible in Packaging & Processing @ PACK EXPO International
See packaging & processing solutions from 2,600 exhibitors and gain insights from 150+ free educational sessions at PACK EXPO International.
REGISTER NOW & SAVE

Create a free Packaging World account to continue reading

OpSec Security: Repositionable Tamper-Evident Labels

Its construction allows the user to reposition the label for up to a full minute on most materials, without activating the void features.

1. Repositionable, non-residue tamper-evident label applied to a surface. 2. Label peeled back after 45 seconds of application. Leaves no residue during repositioning or long-term application, which means no chemicals are required for reconditioning. 3. Void feature displayed when the label is removed a few minutes after reapplication.
1. Repositionable, non-residue tamper-evident label applied to a surface. 2. Label peeled back after 45 seconds of application. Leaves no residue during repositioning or long-term application, which means no chemicals are required for reconditioning. 3. Void feature displayed when the label is removed a few minutes after reapplication.

OpSec Security, a global provider of securing, enhancing, and protecting brands, services and revenues, has developed a fully functioning tamper-evident label that may be repositioned after initial application.

The new repositionable label is a functional tamper-evident optically variable device (OVD) whose construction allows the user to reposition the label for up to a full minute on most materials, without activating the void features. Repositioning becomes necessary during an application when label placement is critical to the aesthetics of the final product.

According to OpSec Security, clients utilizing hand application in their manufacturing facilities were losing product if the tamper-evident label wasn’t precisely placed. By adapting tamper-evident technologies, OpSec provides a product that allows for adjustments, saving money in damaged product.

The label fully activates within minutes after application in which removal will then trigger the void pattern. The pattern may be customized to the client’s specifications with logos, words or numbers. Even the adhesive left behind is easily rolled off by hand. Solvents or cleaning agents are not required to clean the surface, saving time and money during the reconditioning process.

Need help with your packaging project?
We’ve done the legwork to identify and vet experienced packaging and processing consultants you can contact directly for your next project. Decades of combined experience in packaging line engineering, machinery selection, package and materials development, and food processing operations.
See your advisor options now.
Need help with your packaging project?
Is your packaging line built for connected packaging?
RFID, QR codes, and 2D barcodes are reshaping CPG operations. See how leading brands are adapting.
Read More
Is your packaging line built for connected packaging?