Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

Balluff: Infrared temperature sensor

Balluff has developed a new BTS infrared temperature sensor with IO-Link interface and two switching outputs that can monitor temperatures between 250 and 1250 deg. C even in inaccessible or hazardous areas, detect hot objects in motion, and record temperature values, all without contact.

Infrared temperature sensor
Infrared temperature sensor

This pyrometer, in a rugged M30 stainless steel housing with IP67 protection, is the first in this form factor to offer a multi-function display with plain text information and automatic display orientation.

In addition to two switching outputs this pyrometer provides an IO-Link interface for remote parameter setting and direct data exchange with the controller or control panel.

Fill out the form below to request more information about Balluff: Infrared temperature sensor
Annual Outlook Report: Sustainability
The road ahead for CPGs in 2025 and beyond—Packaging World editors review key findings from a survey of 88 brand owners, CPG, and FMCG readers.
Download Now
Annual Outlook Report: Sustainability
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Be the first to find what’s next in packaging & processing at PACK EXPO East. See new solutions from 500 exhibitors, uncover creative ideas for 40+ verticals and gain inspiration from free sessions on industry trends—all in one trip to Philadelphia.
REGISTER NOW & SAVE
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.