See What’s Possible in Packaging & Processing @ PACK EXPO International
See packaging & processing solutions from 2,700 exhibitors and gain insights from 150+ free educational sessions at PACK EXPO International.
REGISTER NOW

Balluff: Infrared temperature sensor

Balluff has developed a new BTS infrared temperature sensor with IO-Link interface and two switching outputs that can monitor temperatures between 250 and 1250 deg. C even in inaccessible or hazardous areas, detect hot objects in motion, and record temperature values, all without contact.

Infrared temperature sensor
Infrared temperature sensor

This pyrometer, in a rugged M30 stainless steel housing with IP67 protection, is the first in this form factor to offer a multi-function display with plain text information and automatic display orientation.

In addition to two switching outputs this pyrometer provides an IO-Link interface for remote parameter setting and direct data exchange with the controller or control panel.

Fill out the form below to request more information about Balluff: Infrared temperature sensor
Need help with your packaging project?
We’ve done the legwork to identify and vet experienced packaging and processing consultants you can contact directly for your next project. Decades of combined experience in packaging line engineering, machinery selection, package and materials development, and food processing operations.
See your advisor options now.
Need help with your packaging project?
Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,700 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
REGISTER NOW
Discover How to Stay Ahead of the Competition at PACK EXPO International