Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

ID Technology: Thermal transfer overprinter

ID Technology’s COM II thermal transfer overprinter has a 300dpi print head that produces sharp, high-quality text, bar codes, logos and Data Matrix codes.

Pw 6014 Webidtech
Suited to high speed production lines, the COM II is designed to integrate into a wide range of flexible packaging machines including vertical and horizontal form/fill/sealers. Communicate with the printer using a PC with web browser software, existing OEM interface or an optional, simple to use touch screen. The COM II has easy, onboard label creation software and multiple message storage, enabling quick and simple message changeover. The patented variable Ribbon Economy function reduces the amount of ribbon used per print without compromising on print resolution. Ribbon retraction feature minimizes the gap between prints, ensuring maximum efficiency of ribbon usage. The COM II has a maximum print speed of 1400mm/sec, uses 1400 meter length ribbon and has a print area of up to 128mm wide x 2400mm long.
Fill out the form below to request more information about ID Technology: Thermal transfer overprinter
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
Read More
Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
Read More
New e-book on Multipacking and Case Packing