Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

William L. Clippard, III honored by The Ohio State University

William L. Clippard, (Bill), chairman of the board, Clippard Instrument Laboratory, Inc., was recently honored by The Ohio State University Department of Mechanical and Aerospace Engineering for his commitment to the field of engineering.

William L. Clippard, III
William L. Clippard, III

For decades, Bill has demonstrated his passion to see engineers graduate with more practical knowledge and applicable/applied skills.

The university honored Bill by dedicating “Lab Space” within the Mechanical Engineering Building as “The Clippard Lab”, in honor of William L. Clippard, III, class of 1963. The new “Clippard Lab”, will provide students the ability to gain exposure to real world challenges while learning leading edge techniques through hands-on skill sets which has been a passion of Bill’s for years.

Since his graduation from OSU’s Mechanical engineering program, Bill has applied his creative mind along with his engineering disciplines to design and create many unique products and manufacturing processes for Clippard. Those same products and processes are used by many industries throughout the world today and serve as the catalyst in establishing Clippard as a world leader in miniature pneumatics.

List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
Download Now
List: Digitalization Companies From PACK EXPO
The AI revolution in packaging robotics is here
Robots that see variations, adjust grip pressure automatically, accept plain-English commands, and predict their own maintenance. Discover how AI is transforming packaging operations.
Read More
The AI revolution in packaging robotics is here