Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

Time-of-flight laser sensor

Balluff now offers an upgraded BOD 63M time-of-flight laser sensor.

Pw 7191 C Balluff
This photoelectric sensor has been revamped with a shorter 200-mm dead zone, a second discrete output, and enhanced resolution of less than 1 mm. The sensor retains features such as a sensing range of 6 m—suitable for many long-range applications measurement—precise material movement, and hopper level detection.

Phone: 800/543-8390 | www.balluff.com

The AI revolution in packaging robotics is here
Robots that see variations, adjust grip pressure automatically, accept plain-English commands, and predict their own maintenance. Discover how AI is transforming packaging operations.
Read More
The AI revolution in packaging robotics is here
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Be the first to find what’s next in packaging & processing at PACK EXPO East. See new solutions from 500 exhibitors, uncover creative ideas for 40+ verticals and gain inspiration from free sessions on industry trends—all in one trip to Philadelphia.
REGISTER NOW & SAVE
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.