Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

X-ray inspection system

New E-Z Tec XR Inspection Systems from Eriez use linear array technology for increased sensitivity and speed. System helps ensure product and package integrity by identifying contaminants, scanning for missing or broken products, detecting packing voids, confirming fill levels, controlling product and package mass and fat analysis.

Pw 8466 E Eriez

System’s user-friendly interface has a 15” touchscreen color display that accesses Windows® XP and shows real-time images and diagnostic data. Automatically analyzes product variations to consistently achieve optimum sensitivity throughout production, without requiring frequent calibration.

Phone: 800/300-3743

www.eriez.com

Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
Read More
Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
Read More
New e-book on Multipacking and Case Packing