Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Omron Electronics LLC: Machine vision sensor

The F10 gray-scale pattern-matching machine vision sensor from Omron (Schaumburg, IL) features new functionality including RS232/422 communication for remote control.

Additionally, an amplifier with 8-bank memory allows use on multiproduct production lines. Applications include label placement and printing verification. It is available in 3 versions with differing sensing areas and sensing distances that range from 33 mm to 100 mm.

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
Read More
New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
Read More
Check out new technology from 2,500+ packaging & processing suppliers