See new packaging innovations in one convenient place at PACK EXPO East
Get up to speed on the latest innovations in packaging and processing at PACK EXPO East, March 18 – 20 in Philadelphia. Don’t miss out!

See Hewlett-Packard technology in action at Pack Expo

Be sure to visit the H-P OEM partners at PACK EXPO International. They'll beat McCormick Place to demonstrate how H-P Thermal Ink Jet Technology canprovide exciting solutions for your package coding needs.

Pw 12679 Guide

During your trip to this year's PACK EXPO International be sure to visit Hewlett-Packard's OEM partners. They'll be at McCormick Place to demonstrate how HP Thermal Ink Jet Technology can provide exciting solutions for your packaging coding needs.

Receive a free Chicago restaurant guide when you stop by any of the following booths:

AT Information Products Booth #N-3404

Collins Ink Corp. Booth #N-5240

Digital Design Booth #S-2807

Nutec Systems Booth #S-1525 #M-22

Prism Inc. Booth #N-4738

RSI Print Systems Booth #E-7466

The restaurant guide is published by Packaging World and sponsored by Hewlett-Packard. This handy reference features the best Chicago has to offer.

For a free copy of the restaurant guide email your request to [email protected] or visit www.hp.com/oeminkjet.

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Discover innovations from 400+ packaging & processing suppliers.
The largest PACK EXPO East in history is March 18-20 in Philadelphia! In one convenient location, you’ll discover new technology from top suppliers, get quality problem-solving time with experts and learn the latest trends in free educational sessions.
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Discover innovations from 400+ packaging & processing suppliers.