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Ossid, a ProMach product brand, will showcase its broad portfolio of packaging machinery at PACK EXPO International 2026, October 18-21 at McCormick Place in Chicago. Featured in Booth S-3558 will be live demonstrations of the ReeMaster NextGen 1100 Automatic Tray Sealer, the NextGen 2115 Weigh Price Labeler, and the Reepack ReeForm E40 Thermoformer.
Ossid is a trusted manufacturer of sustainable, efficient packaging machinery, including tray packaging, flow wrapping, thermoforming, industrial scales, and labeling systems for the food, e-commerce, and medical device industries. As the North American distributor of Reepack, an Italy-based ProMach brand, Ossid offers a comprehensive portfolio of flexible packaging solutions. This partnership enables Ossid to take a consultative approach, recommending the packaging style and equipment best suited to each customer’s application and production goals.
ReeMaster NextGen 1100 Automatic Tray Sealer
Taking center stage is the ReeMaster NextGen 1100 Tray Sealer, a platform that recently made its North American debut and continues to roll out across various markets.
The ReeMaster NextGen 1100 Tray Sealer is engineered to deliver efficiency, precision, and reliability in fresh food production. Built with robust stainless steel washdown construction and an open-frame design, the machine provides easy access for sanitation and maintenance.
The ReeMaster NextGen 1100 supports multiple packaging formats, including traditional sealing, modified atmosphere packaging (MAP), and vacuum skin packaging (VSP), giving processors the flexibility to meet evolving product and market demands.
Servo-driven indexing conveyors and side grippers ensure accurate tray positioning, while tool-free, semi-automatic die-set changeovers help minimize downtime between production runs. A 12-inch full-color HMI touchscreen and proprietary software simplify operation and recipe management.
Designed for seamless integration, the machine features an automatic outfeed modular belt that connects to downstream metal detection or weighing and labeling equipment.
Ossid NextGen 2115 Weigh Price Labeler
The NextGen 2115 Weigh Price Labeler (WPL) is a high-performance solution designed to accurately weigh, price, and label packages in demanding production environments.
Completely redesigned from the ground up, the NextGen 2115 WPL features modular architecture and an open-frame design for improved accessibility and simplified maintenance. Its advanced hybrid control system combines machine controls and software into a single processing unit, enabling faster weighing, price calculation, and labeling.
Equipped with Smart Print technology, the NextGen 2115 increases throughput by 20-40% by eliminating the need to retrack label stock, improving both efficiency and reliability.
Reepack ReeForm E40 Thermoformer
Also on display will be the Reepack ReeForm E40 Thermoformer, a versatile machine designed for both large and small production runs involving ambient packaging, VSP, and MAP. The machine supports both flexible and rigid films, with customizable film widths, forming depths, and cut-off lengths to accommodate a wide range of products and packaging requirements. The ReeForm Series can also produce saddle packs, a popular format for bulk protein packaging.
Featuring a stainless steel open-frame design, the ReeForm E40 is well suited for washdown environments and simplifies cleaning hard-to-reach areas. A user-friendly Allen Bradley control panel enables easy programming and operation for users of all skill levels.
Medical Packaging
Finally, show attendees can also learn how Ossid’s thermoforming and tray sealing technologies support medical device packaging applications. Whether packaging surgical instruments, emergency medical kits, or diagnostic components, Ossid provides hygienic, secure packaging solutions designed for compliance, repeatability, and ease of operation.
To learn more about how these solutions can drive efficiency and performance across your packaging operation, visit Ossid in Booth S-3558 at PACK EXPO International 2026.
