See What’s Possible in Packaging & Processing @ PACK EXPO International
See packaging & processing solutions from 2,600 exhibitors and gain insights from 150+ free educational sessions at PACK EXPO International.
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Alloyd Co., Inc. (DeKalb, IL): Edwin W. Parkinson, president, CEO. —The New Resina® Corp. (Brooklyn, NY): Andrew May, president.

—Rexam Medical Packaging (Mundelein, IL): Jerry Bennish, president, RMP Americas. —Renaissance Industries (Toronto, OH): Richard Dye, president, CEO. —DT Industries (Springfield, MO): Jeff Scheminger, president, DT-Lasko; Ken Peterson, president, DT-Stokes. —Cloud Corp., LLC (Des Plaines, IL): Kevin R. Fitzmeyer, president. —Siemens ElectroCom L.P. (Novi, MI): Bernd Ruppert, vp, automation systems. —Gulf States Paper Corp. (Tuscaloosa, AL): Charles A. Fahs, vp, specialty packaging. —Maxcess Intl. Corp. (Fenton, MO): Marcel Hage, vp, sales and marketing. —MacDermid Graphic Arts (Atlanta, GA): Jerry Hall, vp, worldwide marketing, research and development for printing plates. —Great Lakes Packaging Corp. (Germantown, WI): James Nelson, gen. mgr., container products group. —Arrowhead Systems LLC (Oshkosh, WI): Pat Vincent, vp, gen. mgr., container products group. —Sonoco (Hartsville, SC): Jim C. Bowen, senior vp, global paper operations; Ronald E. Holley, senior vp, global industrial products; Larry O. Gantt, corporate officer. —Pactiv Corp. (Lake Forest, IL): Jerry Killian, consulting professional. —Windmoeller & Hoelscher Corp. (Lincoln, RI): Joseph Tremper, mgr., sales, printing presses.

Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,600 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
REGISTER NOW & SAVE
Discover How to Stay Ahead of the Competition at PACK EXPO International
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