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Columbus Community College Student Receives the 2019 Richard C. Ryan Scholarship

Dorner awards $2,000 to Mechatronics Student Jacob Gaspari

Jacob Gaspari, a student at Columbus Central Community College (Nebraska), has been named recipient of the 2019 Richard C. Ryan Packaging Education Scholarship, funded by Dorner.
Jacob Gaspari, a student at Columbus Central Community College (Nebraska), has been named recipient of the 2019 Richard C. Ryan Packaging Education Scholarship, funded by Dorner.

The Richard C. Ryan Packaging Education Scholarship, sponsored by Dorner, was awarded to Jacob Gaspari, a mechatronics student at Columbus Community College.

Gaspari is the latest winner of this scholarship, meeting rigorous criteria including a GPA of 3.0 or higher, a demonstrated commitment to excellence in the packaging industry and a history of extracurricular involvement at Columbus Community College. Applicants are also required to write an essay describing their career goals in the packaging field.

This $2,000 scholarship, established in honor of Richard C. Ryan, the former president and CEO of Dorner, who passed away suddenly in September 2012, is awarded to a student enrolled in a two- or four-year program at any school partnered with PMMI, The Association for Packaging and Processing Technologies. Ryan was a member of the PMMI Board of Directors and was an advocate of lifelong learning. This commitment to education and PMMI inspired the creation of a scholarship in his name.

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Annual Outlook Report: Workforce