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Rockwell Automation to sponsor PACK gives BACK

This year’s event will benefit the PACK EXPO Scholarship.

In conjunction with its participation in PACK EXPO 2017, Rockwell Automation will help to support scholarships for future packaging professionals through a title-level sponsorship of this year’s PACK gives BACK™ event, reports PACK EXPO producer, PMMI, The Association for Packaging and Processing Technologies. The event will feature legendary rock and roll band, The Doobie Brothers, and take place at PACK EXPO Las Vegas and Healthcare Packaging EXPO 2017 (Sept. 25-27, 2017, Las Vegas Convention Center).

 

PACK gives BACK is an annual fundraising event with a portion of the ticket sales going to a charitable cause. This year’s event will benefit the PACK EXPO Scholarship which provides grants to U.S. and Canadian colleges with packaging and processing programs.

 

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