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Brand owners and their packaging partners will discover how they can connect the journey from design to print at PACK EXPO International 2026, when Esko demonstrates how a more integrated approach can accelerate speed to market, strengthen compliance and support sustainability across the packaging value chain.
From October 18-21, Esko will exhibit in the West Hall - Packaging and Printing Pavilion (Booth W-30022) of Chicago’s McCormick Place convention center, giving visitors the opportunity to experience how its portfolio of connected software solutions is helping brands and suppliers move towards a more agile, data-driven packaging workflow.
Esko will showcase the latest advances in its evolving AI-infused Esko S2 cloud platform, which brings packaging processes, specification data and stakeholders together to help eliminate disconnected workflows and orchestrate a more efficient route from initial concept through to print production.
“Today’s packaging teams are under increasing pressure to launch products faster while managing greater complexity around compliance, sustainability and the sheer volume of packaging assets they need to manage,” said Jan De Roeck, Esko Director of Marketing, Industry Relations & Strategy. “Our focus at PACK EXPO Chicago is on showing brands and their packaging partners how connected workflows can remove those barriers. By bringing product and packaging intelligence, design, artwork, compliance, quality and production processes together, Esko is helping customers build a faster, more controlled and more sustainable path from design to print.”
Jan said that Esko would use the four-day expo to highlight the latest tools and modules in its innovative packaging solutions such as WebCenter Enterprise, Comply and WebCenter Go, all now available for both CPG and pharmaceutical packaging, with validation capabilities enabled to address the additional requirements of regulated packaging environments.
“WebCenter Enterprise provides a central packaging management environment that connects stakeholders, processes and content across the packaging lifecycle,” he said. “By creating a single source of packaging information and enabling controlled collaboration and approvals, it helps organizations reduce delays and improve operational visibility.
“Comply brings AI-powered compliance into the packaging workflow, helping teams identify potential issues earlier and streamline the process of ensuring artwork meets relevant requirements,” he said. “For brands managing complex portfolios and multiple markets, this can help reduce the risk of costly errors and rework while supporting right-first-time packaging.
“And WebCenter Go provides an accessible packaging management solution designed to simplify collaboration and workflow management, helping teams move packaging projects forward more efficiently,” he said. “Together, the solutions demonstrate our broader shift towards connected, cloud-enabled packaging management through Esko S2 cloud, helping organizations bring speed, compliance and sustainability considerations into the workflow earlier.”
Esko will also demonstrate to PACK EXPO visitors how the wider ecosystem connects packaging development with structural design, visualization and production planning, showcasing the structural design and virtual prototyping capabilities of ArtiosCAD, while Studio enables packaging teams to create and visualize designs in 3D.
“For an immersive demonstration, visitors will also be able to experience Store Visualizer, seeing the digital twins of packaging concepts in a virtual retail environment,” said Jan. “This technology enables teams to assess how packaging, displays and branded items work together on shelf, helping inform design decisions significantly earlier in the development process.”
At the production end of the workflow, Esko will demonstrate how Cape Pack Prime optimizes packaging and palletization decisions to improve load efficiency, reduce transportation costs and support more sustainable logistic strategies. “Speed to market does not have to come at the expense of control or sustainability,” added Jan. “When the right data is available at the right point in the workflow, teams can make better decisions earlier, avoid unnecessary iterations and ultimately get compliant, optimized packaging to market faster.”
Jan said the Esko booth will also highlight how sustainability benefits extend beyond packaging design and management and into the print process itself. “With the Esko CDI Quartz XPS ecosystem, converters can help brands combine the high-quality graphics and consistency traditionally associated with gravure with the sustainability advantages of modern flexographic printing,” he said. “Quartz enables high-quality print on recyclable and mono-material substrates with any degree of PCR content while its surface technology can support lower ink volumes, with potential ink savings of up to 20%. This provides converters with a compelling proposition for brands looking to meet evolving PPWR requirements without compromising shelf impact, color quality or production efficiency.”
Esko will also share its vision for the future of packaging workflows on the PACK EXPO Innovation Stage. Pre-Sales Solution Consultant James McMonigal will explore how AI-powered artwork management can help organizations address the growing complexity of packaging portfolios, improve compliance and drive greater operational efficiency at scale. The presentation, ‘AI-Powered Artwork Management: Ensuring Compliance & Operational Efficiency at Scale’ will take place on Wednesday, October 21, from 10:30–11:00 AM at the Innovation Stage 3 (N-4585), North Hall.
Visitors are invited to join the Esko team at Booth W-30022 of PACK EXPO International and discover how the connected portfolio brings together design, artwork management, compliance, visualization and production planning to create a more streamlined route from design to print.
To book a demonstration or meeting with the team, visit https://calendly.com/marion-sicre/pack-expo-international-2026
