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Balluff: Distributed modular I/O for industrial ethernet

Balluff’s new generation of distributed modular I/O can be used in a cost effective way to replace standard slice I/O and distributed I/O solutions.

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Provides expandable architecture for EtherNet/IP and PROFINET controls applications and offers IP67 protection and industry standard connectors. Using standard 3-conductor cables, up to 4 slave devices can be connected to each master block, which communicates over the industrial Ethernet network to the controller.  Instead of a backplane, each I/O device is connected to an industry-standard M12 port, creating an IP67 connection.  With the ability to be installed within a 20-meter radius from the master device, slave devices can be easily distributed across the machine.
Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
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Annual Outlook Report: Workforce
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
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List: Digitalization Companies From PACK EXPO