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Balluff: Distributed modular I/O for industrial ethernet

Balluff’s new generation of distributed modular I/O can be used in a cost effective way to replace standard slice I/O and distributed I/O solutions.

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Provides expandable architecture for EtherNet/IP and PROFINET controls applications and offers IP67 protection and industry standard connectors. Using standard 3-conductor cables, up to 4 slave devices can be connected to each master block, which communicates over the industrial Ethernet network to the controller.  Instead of a backplane, each I/O device is connected to an industry-standard M12 port, creating an IP67 connection.  With the ability to be installed within a 20-meter radius from the master device, slave devices can be easily distributed across the machine.
Conveying Innovations Report
Editors report on distinguishing characteristics that define each new product and collected video demonstrating the equipment or materials as displayed at the show. This topical report, winnowed from nearly 300 PACK EXPO collective booth visits, represents a categorized, organized account of individual items that were selected based on whether they were deemed to be both new, and truly innovative, based on decades of combined editorial experience in experiencing and evaluating PACK EXPO products.
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Conveying Innovations Report
Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
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Annual Outlook Report: Workforce