Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

B&R Industrial Automation: I/O slice system

B&R Industrial Automation introduces its X20 System, a complete control solution as well as a remote I/O system. System can work as an addition to a standard fieldbus to expand existing control systems, or as a complete controller, demonstrating its full performance capability when combined with X20 System CPUs.

Pw 11089 Br Indus X20sys

Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing