Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

National Instruments: Interface link

The MXI-4 high-speed serial interface link from National Instruments is compatible with the latest PCI standards found in high-performance servers and workstations.

Pw 12840 Natlnst

With MXI-4, engineers can combine PXI-based modular instrumentation with computers in applications requiring intense data analysis or real-time numerical calculations. Permits control of PXI and CompactPCI systems from any PCI slot. Remote control of systems from computers is done by implementing a PCI-PCI bridge across a high-bandwidth link at 132 MB/s peak performance and 78 MB/s sustained performance. Works in harsh, electrically noisy industrial environments.

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers