Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.

Hoffman: I/O enclosures

Hoffman (Anoka, MN) has added 10 new enclosure modules for I/O devices to its Inline® Instrumentation Enclosure Series. Full-length mounting brackets welded to the top and bottom of the enclosure provide flexible mounting.

Pw 16108 Hoff

The enclosures are available in 5 different widths and feature either solid or window doors.

Coding, Marking, and Labeling Innovations Report
Explore our editor-curated report featuring cutting-edge coding, labeling, and RFID innovations from PACK EXPO 2024. Discover high-speed digital printing, sustainable label materials, automated labeling systems, and advanced traceability solutions that are transforming packaging operations across industries.
Access Report
Coding, Marking, and Labeling Innovations Report
Smart Filling Equipment Selection Guide
Discover the six critical factors that determine filling equipment success and avoid costly selection mistakes that drain profits.
Read More
Smart Filling Equipment Selection Guide