Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

Ultra-Compact Industrial PCs

Beckhoff launches compact IPC suited for IoT, machine control, cloud connectivity and edge device requirements.

Beckhoff Automation
Beckhoff Automation

Beckhoff Automation debuted a new line of compact industrial PCs during PACK EXPO International 2018. Representing the newest generation of Beckhoff Industrial PCs (IPCs), the C6015, C6017 and C6030 IPCs are Microsoft Azure™ Certified, and they are just as capable to work with Amazon Web Services (AWS), SAP HANA and other major cloud services. The first entry into this range, the C6015, incorporates an Intel® Atom™ processor (up to four cores), and the newer C6030 uses Intel® Core™ i-series processors of the 6th and 7th Generation. The latest entry into the range, the C6017, offers the same Intel® Atom™ processors found in the C6015, but adds two more RJ45 interfaces and two additional USB 2.0 ports. An optional capacitive 1-second UPS is also available in the C6017. The three IPCs are ideally suited for all IoT, machine control, cloud connectivity and edge device requirements in manufacturing.

Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Be the first to find what’s next in packaging & processing at PACK EXPO East. See new solutions from 500 exhibitors, uncover creative ideas for 40+ verticals and gain inspiration from free sessions on industry trends—all in one trip to Philadelphia.
REGISTER NOW & SAVE
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Annual Outlook Report: Automation & Robotics
What's in store for CPGs in 2025 and beyond? Packaging World editors explore the survey responses from 118 brand owners, CPG, and FMCG Packaging World readers for its new Annual Outlook Report.
Download
Annual Outlook Report: Automation & Robotics