Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Machinery/adhesive tape technology creates multipacks

The Multipack Solution from 3M comprises the company's Scotch® Clean Removal Multipack Tape and CEFMA bundling equipment to create multipacks without damaging the primary packaging. Able to create up to 70 packs/min, depending on application, The Multipack Solution is an alternative to multi-unit and promotional packaging such as bags, shrink wrap, chipboard and trays.

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers