New Tool: ProSource
Checkout our packaging and processing solutions finder, ProSource.

Columbia Machine: High speed floor palletizer

Columbia Machine recently introduced the FL6200 high-speed palletizer, a floor-level design that combines robotic-like precision with the familiar simplicity and load build quality of a conventional palletizing solution.

High speed, floor level palletizer
High speed, floor level palletizer

The FL6200 can palletize up to 120 cases/min., depending on layer pattern, and can manage standard and challenging products including shallow unwrapped trays, shrink pads, film-only bundles and more.

Palletizer includes Category 3, Performance Level D safety components and incorporates fully integrated guarding, full height light curtains, automatic four-point hoist pins, case infeed tunnel and interlocked load building area access doors. This safety package keeps your employees safe while still being operationally “friendly” and meeting production demands by providing convenient and safe access when needed.

The FL6200 utilizes Columbia’s easy to operate Product Manager HMI, servo-actuated layer transfer and load building area hoists, servo actuated bi-parting apron plates and modular construction that allows for multiple layout configurations to fit site constraints. Users can effortlessly create and modify layer patterns, view and export production reports, adjust component speeds and timer settings, and also access manuals and schematics, all through the HMI. Graphic pattern screens can be created at the HMI to aid recovery and provide graphic representation of diagnostics, improving OEE.

Fill out the form below to request more information about Columbia Machine: High speed floor palletizer
Discover Our Content Hub
Access Packaging World's free educational content library!
Read More
Discover Our Content Hub
How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
Read More
How Can You Honor a Leader?