Smart Packaging 2004 announced

Smart Packaging 2004 is being launched alongside Labelexpo Americas 2004, taking place next year on the 14-15 of September at the Donald E. Stephens Convention Center in Chicago.

Developed in cooperation with the Institute of Packaging Professionals, the two-day keynote conference will cover all aspects of smart packaging and is expected to attract more than 200 delegates from the labeling, packaging, and end-user sectors. The event will be supported by the Tag and Label Manufacturers Institute.

Session 1 of the conference will include papers presented by leading brand owners/end users in the food/supermarket, pharmaceuticals, drinks, cosmetics/toiletries, and household/consumer products sectors.

Session 2 will review packaging protection requirements and solutions ranging from counterfeit deterrence, retail theft, and tamper resistance.

Session 3 will examine the need for packaging authentication and verification requirements and the ways these can be provided.

Session 4 will assess current packaging requirements and solutions in the fields of logistics, handling and storage, and supply chain management.

More in Primary packaging