Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

Rockwell Automation: IO-Link master

Manufacturers and industrial operators can now access more detailed sensor diagnostics in harsh operating environments using the IP67-rated, Allen-Bradley ArmorBlock IO-Link master from Rockwell Automation.

IO-Link master
IO-Link master

The device builds on the company’s IO-Link portfolio with event and process timestamping capabilities for on-machine applications.The new IO-Link master stores up to 40 timestamps of sensor events on each channel. This event history can help users track changes and more easily diagnose issues. Input timestamps of all sensor data also can be sent to the controller upon a change of state. These and other diagnostics available through the device can reduce issue-resolution time by as much as 90%t, improve preventive maintenance and optimize overall system performance.

While the device is ruggedized for use in harsh applications, the Rockwell Automation portfolio also includes an in-cabinet solution for light applications. The on-machine option requires only a single cable from the cabinet, reducing the number and length of cable runs and potential failure points. The ArmorBlock IO-Link master includes connectivity for up to eight IO-Link sensors. The master and sensors share an IP address, helping end users reduce the cost and time to commission equipment.

Conveying Innovations Report
Editors report on distinguishing characteristics that define each new product and collected video demonstrating the equipment or materials as displayed at the show. This topical report, winnowed from nearly 300 PACK EXPO collective booth visits, represents a categorized, organized account of individual items that were selected based on whether they were deemed to be both new, and truly innovative, based on decades of combined editorial experience in experiencing and evaluating PACK EXPO products.
Take me there
Conveying Innovations Report
Annual Outlook Report: Automation & Robotics
What's in store for CPGs in 2025 and beyond? <i>Packaging World</i> editors explore the survey responses from 118 brand owners, CPG, and FMCG <i>Packaging World</i> readers for its new Annual Outlook Report.
Download
Annual Outlook Report: Automation & Robotics