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Get up to speed on the latest innovations in packaging and processing at PACK EXPO East, March 18 – 20 in Philadelphia. Don’t miss out!

Markem-Imaje: Markem-Imaje: Markem-Imaje: Markem-Imaje: PackML demonstration

Elau (Chicago, IL) will demonstrate its support for the OMAC Packaging Workgroup’s model by interfacing a Markem (Keene, NH) coder to an Elau control system via PackML.

The new state model defines the basic operating states of all packaging machines in the same way, finally making it easy to coordinate the entire packaging line. Elau is working with the OMAC Packaging Workgroup to encourage adoption of the model throughout the packaging industry.

Discover innovations from 400+ packaging & processing suppliers.
The largest PACK EXPO East in history is March 18-20 in Philadelphia! In one convenient location, you’ll discover new technology from top suppliers, get quality problem-solving time with experts and learn the latest trends in free educational sessions.
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Discover innovations from 400+ packaging & processing suppliers.
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