Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

QComp Technologies, Inc: Robotic lid applicator

Delivering speeds up to 240 lids/min., QComp’s robotic lid applicator product line has been expanded to include a high-capacity robotic lid dispenser that uses a unique feed system to maximize production and reduce loading time.

Pw 43244 30e46b9bb83f44b788f26b8f93bdcda9

The QComp lid feed system combined with high-speed delta robots can be configured in single and dual cells. LPSX technology, now a standard option for all lid applicators, maximizes production by allowing an operator to inspect the glue patterns on the lid, without interrupting the production process. Minimizing loading time allows operators to focus less on restocking the machine and more on other tasks.

 

Fill out the form below to request more information about QComp Technologies, Inc: Robotic lid applicator
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Be the first to find what’s next in packaging & processing at PACK EXPO East. See new solutions from 500 exhibitors, uncover creative ideas for 40+ verticals and gain inspiration from free sessions on industry trends—all in one trip to Philadelphia.
REGISTER NOW & SAVE
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
The AI revolution in packaging robotics is here
Robots that see variations, adjust grip pressure automatically, accept plain-English commands, and predict their own maintenance. Discover how AI is transforming packaging operations.
Read More
The AI revolution in packaging robotics is here