Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Print-and-apply unit

Alpha Dot USA (Belle Mead, NJ) introduces the Eclipse, an advanced print-and-apply thermal-transfer labeling system for secondary package identification.

Pw 21608 Alp Dot Usa Bel 24

An integral conveyor guides outer cases, trays or sacks past the label printer and applies printed labels to the sides of packages. An optional tuck unit allows labels to be wrapped around the corner of a case.

Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing