Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Schneider Electric ELAU Packaging Solutions: PC-based controller

Suitable for use in form/fill/seal, flow wrapping, cartoning, labeling and blister forming machinery, the PacDrive™ PC-based controller/servo drive system from Elau (Chicago, IL) is a fully digital system that replaces mechanical main shafts.

Pw 19385 S Pw 0300 070

The system features a compact design and standard buses.

Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing