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2014 Packaging Scholarship announced

The recipient of Packaging World’s 2014 Future Leaders in Packaging Scholarship is the Packaging Program at Virginia Tech, Blacksburg, VA.

This marks the third year that this scholarship is being awarded in conjunction with Packaging World’s Leaders in Packaging (LIP) program. Companies who participate in LIP are supporters of this annual educational award.

Virginia Tech’s packaging program focuses on providing a multidisciplinary experience for the students to help them be leaders in system-based sustainable packaging design. The curriculum is designed to provide hands-on and minds-on knowledge on the principles of Marketing, Design, Science, and Engineering. Throughout their four years, the students learn how the components of packaging systems interact with each other and also how marketing and design principles are influencing packaging design decisions. The program is also a pioneer in the education of Lean manufacturing principles for packaging systems. Students learn the basics of Lean manufacturing principles and also have a chance to practice implementing them in both lab and industrial settings.

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