ESKO will sponsor Clemson University’s Consumer-Driven Package Design exhibit, one of the most dynamic show floor events at PACK EXPO International and Pharma EXPO 2016 (Nov. 6-9; McCormick Place, Chicago), reports PACK EXPO Producer, PMMI, The Association for Processing and Packaging Technologies. Clemson’s interactive exhibit (Booth N-4543) will explore the impact of packaging on consumers.
“Clemson University’s exhibit displays technology that will be crucial to product development and will create a memorable experience for PACK EXPO attendees. ESKO is proud to invest in students that are making a difference in the packaging industry,” says Phillipe Adam, vice president of Global Marketing at ESKO.
The Clemson booth will include multiple interactive stations including an immersive virtual reality shopping experience and advanced eye tracking software. Participating attendees will receive an email with their results in the form of aggregated data and heat maps that can provide insights on how to improve their products through consumer testing.
“The Clemson exhibit showcases the next generation’s involvement in this industry, gives the students a platform to share their contributions and positions them at the forefront of future technology in packaging,” says Chuck Yuska, president and CEO of PMMI. “Year after year, attendees are fascinated by the advances that surface from this exhibit, and we are looking forward to their presence on the show floor again at PACK EXPO International 2016.”
Register now for PACK EXPO International and Pharma EXPO 2016 at packexpointernational.com. Registration for PACK EXPO and Pharma EXPO is $30 through Oct. 21, when it increases to the on-site fee of $100.