The 2021 Virtual ISTA Forum, including TransPack and TempPack will be held on Tuesday, March 30th and Wednesday, March 31st. (Premier sponsor spotlights will be held on Thursday, April 1st.)
- TransPack program focuses on case studies, research, and solutions related to the optimization of packaging for transport. Testing & Design, E-commerce, Sustainability, and COVID’s impact on the Supply Chain are just some of the topics covered.
- TempPack program focuses on technical topics related to global temperature controlled performance packaging. Best practices, pandemic challenges, sustainability, and ultra-low temp cold chain are just some of the topics covered.
The Forum program will offer a blend of presentations, thought-provoking group discussions and interactive networking to make the most of the virtual experience. The focused group discussions will offer attendees an opportunity to participate in an extended conversation around a shared theme or topic while discussion leaders introduce and facilitate the topics.
For more information or to register, click here.
Participating companies on the program: