Supporting this event as a Tier One participant PLCopen joins other associations who are leading forces in the exchange of ideas and collaboration with an invested interest in the future of processing and packaging.
Visiting the PLCopen booth, C-1254, in the Association Partner Pavilion, attendees will learn how PLCopen standards are enabling The Internet of Things, Industrial Internet of Things, Industry 4.0, and Smart Factory applications to keep their companies competitive. These applications are simplified by using PLCopen standards. Attendees will gain the information and independent perspectives to solve problems, identify best practices, simplify training, and collaboratively engineer solutions to have a competitive edge.
PLCopen joins with OMAC and the OPC Foundation at this event to show that the combined technologies and standards contribute even more to the industry. All three organizations have a focus to a different section of the production flow; however combine excellently with their vision, standards, and activities.
In addition we can inform you on the new initiatives PLCopen recently started regarding:
• PackML submodel example for the AAS
• Asset Adminstration Shell of Industry 4.0
• Benchmarking
• Object Orientation
Throughout the tradeshow PLCopen members will demonstrate PLC, embedded, and other industrial control products incorporating PLCopen standards that users, machine builders, and system integrators can use to more precisely and efficiently meet customer needs.
“PACK EXPO has been an outstanding event for many years for engineers to learn about the latest technology, standards, and best practices.” says Eelco van der Wal, PLCopen Managing Director.
