See What’s Possible in Packaging & Processing @ PACK EXPO International
See packaging & processing solutions from 2,600 exhibitors and gain insights from 150+ free educational sessions at PACK EXPO International.
REGISTER NOW & SAVE

Create a free Packaging World account to continue reading

Econocorp welcomes new Director of Engineering

Econocorp, Inc., welcomes Daniel R. Chouinard as the company’s Director of Engineering.

Chouinard brings over 15 years of high-level engineering experience to Econocorp working for such notable companies as Invensys, Brooks Automation, and Bose Corporation. 

He received his BS Mechanical Engineering from the University of Massachusetts in 1996 and his High-Tech MBA from Northeastern University in 2009.  His responsibilities will include managing the engineering department, overseeing all ECONOSEAL machine design and documentation efforts, and providing input as a member of the Econocorp management team.
Co-packers: the competitive gap is widening
Brands want more than low bids. See what automation, services, and sustainability mean for CM/CPs in 2026.
Read More
Co-packers: the competitive gap is widening
Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,600 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
REGISTER NOW & SAVE
Discover How to Stay Ahead of the Competition at PACK EXPO International