Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Tri-Tronics Company: High-resolution sensor

The MARK-EYE® Pro from Tri-Tronics is a high-speed (45us response time), high-resolution sensor designed to accurately detect printed registration marks on continuous web machinery.

Pw 2320 Webtritronics
The sensor uses the broadband characteristics of a white LED light that provides the high resolution needed for detecting a wider range of color combinations on any color background.  Other features include:  easy one-touch AUTOSET setup; high immunity to ambient light; 5-LED contrast indicator; selection of lens and fiberoptic light guides.
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing