Hyde Park Electronics: Ultrasonic sensors

Able to withstand severe, corrosive-type environments are the new 30-mm Superprox® Model SM906A-7-STS series ultrasonic analog sensors. From Hyde Park Electronics (Dayton, OH), the sensors combine a stainless-steel-faced transducer with stainless-steel housing.

Aug 31, 2000

Detect moving objects in a sensing range of 120 mm to 1 m (4.7” to 39”). Withstand caustic washdown solutions.

Telemecanique Sensors

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Annual Outlook Report: Sustainability

Annual Outlook Report: Workforce

Annual Outlook Report: Automation & Robotics

Machinery Basics

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Through the Line: Packaging and Processing

Through the Line Podcast: Glacier's AI Tool Turns Recycling Data into Insight

Pilots with Colgate-Palmolive and Amazon helped shape Glacier’s new DataStream platform, a subscription tool launched today that lets CPGs verify recyclability performance and close the loop between packaging design and real sortation and recovery outcomes.

According to Rockwell Automation’s 2025 State of Smart Manufacturing Report, CPG companies cite quality improvement (45%), cost reduction (44%), revenue growth (43%), risk reduction (40%), and higher OEE (40%) as the top business outcomes they expect from smart manufacturing investments. Nearly 70% of companies not yet using smart manufacturing plan to invest within the next 12 months.

Automation Fair Q&A: Inside Rockwell’s Push Toward Autonomous Packaging for CPGs

High-volume production runs highlight the scale of Babybel’s global transition from cellophane to paper packaging.

Babybel Latest Brand to Join Paperization Trend

From plain pack stock image (left) to a (hypothetical) branded prototype, shown in context on a shower shelf (right), AI artwork and context images now take minutes, not weeks.

How AI Is Rewriting the Rules of New Product and Package Testing

Innovative packaging solutions

List: Digitalization Companies From PACK EXPO

Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.

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List: Digitalization Companies From PACK EXPO

Annual Outlook Report: Workforce

Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.

Download Now

Products

Pacific Labeling & Integration's ECH200 Pro Handheld High Resolution Printer

Hyde Park Electronics: Ultrasonic sensors

Telemecanique Sensors

Annual Outlook Report: Sustainability

Annual Outlook Report: Workforce

Annual Outlook Report: Automation & Robotics

Get a Quick Overview of Conveyors

How Do Horizontal Form/Fill/Seal Machines Work?

A Video Overview of Liquid Filling Machines

What Can You Package on a Vertical Form/Fill/Seal Machine?

Through the Line Podcast: Glacier's AI Tool Turns Recycling Data into Insight

Automation Fair Q&A: Inside Rockwell’s Push Toward Autonomous Packaging for CPGs

Babybel Latest Brand to Join Paperization Trend

How AI Is Rewriting the Rules of New Product and Package Testing

Innovative packaging solutions

Handheld Coding and Marking Printer

Manufacturing Intelligence Software

Palletizing Kit

Packaging World Resource Guide 2026

Nov/Dec 2025

October 2025

PELV Showcase 2025

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Humanoid Robots in Packaging and Processing: 2025 Status Report

Conveying, Feeding & Inserting e-book