See new packaging innovations in one convenient place at PACK EXPO East
Get up to speed on the latest innovations in packaging and processing at PACK EXPO East, March 18 – 20 in Philadelphia. Don’t miss out!

Device-level buses

A tutorial from Interlink BT (Minneapolis, MN) provides a thorough explanation of a variety of currently available buses such as DeviceNet(TM), Profibus(TM), Smart Distributed System (SDS)(TM), Sercos(TM), CANbus(TM), Interbus-S(TM), Seriplex® and others.

Pw 22539 Atutfro Int 1

The tutorial covers topics such as types of signals, transmission distance, data encoding, protocols, messaging and bus network layouts. Discusses common bus problems and troubleshooting procedures.

Discover innovations from 400+ packaging & processing suppliers.
The largest PACK EXPO East in history is March 18-20 in Philadelphia! In one convenient location, you’ll discover new technology from top suppliers, get quality problem-solving time with experts and learn the latest trends in free educational sessions.
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Discover innovations from 400+ packaging & processing suppliers.
How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
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How Can You Honor a Leader?