Sensors feature a smooth, IP 69K stainless steel housing that
withstands harsh wash down applications. Housing also reduces bacteria
growth that can result when food particles become lodged in small
grooves or crevices.
Companies in this article
SICK, Inc: Photoelectric sensor
Sick’s W4S-3 photoelectric sensor incorporates OES3 technology into its third generation custom ASIC (application-specific integrated circuit) to ignore stray background reflections, detect multi-colored or shiny objects, and provide high immunity to ambient light.
Feb 6, 2010
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Machinery Basics
Conveying Innovations Report
Editors report on distinguishing characteristics that define each new product and collected video demonstrating the equipment or materials as displayed at the show. This topical report, winnowed from nearly 300 PACK EXPO collective booth visits, represents a categorized, organized account of individual items that were selected based on whether they were deemed to be both new, and truly innovative, based on decades of combined editorial experience in experiencing and evaluating PACK EXPO products.
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Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
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