SICK, Inc: Photoelectric sensor

Sick’s W4S-3 photoelectric sensor incorporates OES3 technology into its third generation custom ASIC (application-specific integrated circuit) to ignore stray background reflections, detect multi-colored or shiny objects, and provide high immunity to ambient light.

Feb 6, 2010

Sensors feature a smooth, IP 69K stainless steel housing that withstands harsh wash down applications. Housing also reduces bacteria growth that can result when food particles become lodged in small grooves or crevices.

SICK, Inc.

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SICK, Inc: Photoelectric sensor

SICK, Inc.

Coding, Marking, and Labeling Innovations Report

List: Digitalization Companies From PACK EXPO

Our List of Cobot Palletizing Solutions

A Video Overview of Liquid Filling Machines

What Can You Package on a Vertical Form/Fill/Seal Machine?

A Look into the World of Cartoning Equipment

A Look at Feeding and Inserting Equipment on the Packaging Line

A Video Overview of Liquid Filling Machines

Sustainable Packaging Trends to Watch at PACK EXPO Las Vegas

QR Code Brings Play to Danone’s Plant-Based Kids Line

Global Packaging Trends Point to a New Strategic Approach

Engineered Liquid Mixing Systems Increase Process

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