SICK, Inc: Photoelectric sensor

Sick’s W4S-3 photoelectric sensor incorporates OES3 technology into its third generation custom ASIC (application-specific integrated circuit) to ignore stray background reflections, detect multi-colored or shiny objects, and provide high immunity to ambient light.

Feb 6, 2010

Sensors feature a smooth, IP 69K stainless steel housing that withstands harsh wash down applications. Housing also reduces bacteria growth that can result when food particles become lodged in small grooves or crevices.

SICK, Inc.

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SICK, Inc: Photoelectric sensor

SICK, Inc.

Annual Outlook Report: Workforce

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What Can You Package on a Vertical Form/Fill/Seal Machine?

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Grove Toilet Cleaner Pods Reduce PVA, Use Compostable Pouch

Coca-Cola's Topo Chico Innovates in Case Gluing and Sealing

2025 Packaging State of the Industry: U.S. Expands, Canada Maintains Strong Base

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