SICK, Inc: Photoelectric sensor

Sick’s W4S-3 photoelectric sensor incorporates OES3 technology into its third generation custom ASIC (application-specific integrated circuit) to ignore stray background reflections, detect multi-colored or shiny objects, and provide high immunity to ambient light.

Feb 6, 2010

Sensors feature a smooth, IP 69K stainless steel housing that withstands harsh wash down applications. Housing also reduces bacteria growth that can result when food particles become lodged in small grooves or crevices.

SICK, Inc.

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SICK, Inc: Photoelectric sensor

SICK, Inc.

The packaging innovations from PACK EXPO worth your attention.

Discover Leading Suppliers

Redefine What’s Possible in Packaging & Processing—Register Now & Save!

What Can You Package on a Vertical Form/Fill/Seal Machine?

Quality Control Masters: The Ultimate Guide to Packaging Inspection Equipment

A Look into the World of Cartoning Equipment

A Look at Feeding and Inserting Equipment on the Packaging Line

Skincare Brand Right-Sizes Transport Packaging Across a 60-SKU Line

Icy Hot's Scratch-and-Sniff Carton Solves a Shelf Problem

Portion Packaging Brings Big Efficiencies

Drone Delivery Puts Pharma Packaging to the Test

What You Think You Know About Product Marking Has Changed

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