Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

System On Chip

Hilscher has released netX, a System On Chip for products that support industrial network connectivity. Supports as many as 4 network connections, including master and slave for Ethernet IP, Profinet, EtherCAT, Ethernet Powerlink, Sercos II, Profibus, InterBus, DeviceNet, AS-I, CC-Link, CAN, Ethernet, and Serial connections.

Pw 9600 C Hilscher

Offers a cost-effective solution for component builders to design and produce products that support the many global network standards, allowing machine builders to design for minimal engineering to comply with local network standards.

Phone: 011/49.6190.99070
www.hilscher.com

Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
Download Now
Annual Outlook Report: Workforce
Annual Outlook Report: Sustainability
The road ahead for CPGs in 2025 and beyond—Packaging World editors review key findings from a survey of 88 brand owners, CPG, and FMCG readers.
Download Now
Annual Outlook Report: Sustainability