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Compact ultrasonic sensors with IO-link technology

The new device can be taught as a standard sensor via teach-by-wire or programmed and used via IO-Link.

Turck
Turck

To further diversify its ultrasonic sensor portfolio, Turck showcased a new compact ultrasonic sensor with IO-Link technology during PACK EXPO International 2018 in booth N-5753. The cost-effective design of this sensor still offers the advantages of a standard ultrasonic sensor as well as communication and advanced functions via IO-Link (Version 1.1).

The new device can be taught as a standard sensor via teach-by-wire or programmed and used via IO-Link. Advanced functions such as synchronization allows multiple sensors to be synchronized together without the risk of interfering with each other. When used in this mode, all sensors will transmit and receive information together, which increases the coverage area and provides a single output from multiple sensors.

Additionally, multiplexing mode allows several sensors to be mounted close together without interference while providing individual outputs.

These sensors are offered in front and side sensing models, rated to IP67, and available with M18 threaded barrel housings and M12x1 Eurofast connectors.

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