Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Pluggable connectors for I/O module wiring

The Wago-I/O-System from Wago Corp. has been expanded to offer pluggable connectors for I/O module wiring. This new series, designated the 753 Series, means customers can now pre-manufacture wiring harnesses using the 753 Series Connectors and simply plug them into the 753 Series I/O modules; a variety of both analog, digital, and special function modules are available.

Pw 11390 We Wago

This simplifies installation and reduces wiring errors in the field.

Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing