Produced by Pira International and IDTechEx, Packaging World will serve as a media partner for the event. Intelligent and Smart Packaging USA will focus on technologies and applications the producers say will likely dramatically change brand management and the supply chain during the next 10 years. Technologies to be covered include electronic article surveillance, radio frequency Identification, "smart" inks and diagnostics. The conference brings together major users, early adopters, and presentations from those involved in the technologies. The conference permits attendees to discover crucial issues, debate future opportunities, and learn about current applications. For more information, call 011/44.1372.802.164, or visit www.piranet.com.
Smart Packaging conference nears
The second annual Intelligent and Smart Packaging USA conference and trade show is set for January 27 –28 at the Las Vegas Hilton.
Dec 31, 2003
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Conveying Innovations Report
Editors report on distinguishing characteristics that define each new product and collected video demonstrating the equipment or materials as displayed at the show. This topical report, winnowed from nearly 300 PACK EXPO collective booth visits, represents a categorized, organized account of individual items that were selected based on whether they were deemed to be both new, and truly innovative, based on decades of combined editorial experience in experiencing and evaluating PACK EXPO products.
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What's in store for CPGs in 2025 and beyond? <i>Packaging World</i> editors explore the survey responses from 118 brand owners, CPG, and FMCG <i>Packaging World</i> readers for its new Annual Outlook Report.
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