Produced by Pira International and IDTechEx, Packaging World will serve as a media partner for the event. Intelligent and Smart Packaging USA will focus on technologies and applications the producers say will likely dramatically change brand management and the supply chain during the next 10 years. Technologies to be covered include electronic article surveillance, radio frequency Identification, "smart" inks and diagnostics. The conference brings together major users, early adopters, and presentations from those involved in the technologies. The conference permits attendees to discover crucial issues, debate future opportunities, and learn about current applications. For more information, call 011/44.1372.802.164, or visit www.piranet.com.
Smart Packaging conference nears
The second annual Intelligent and Smart Packaging USA conference and trade show is set for January 27 –28 at the Las Vegas Hilton.
Dec 31, 2003
Companies in this article
Recommended
Recommended
Machinery Basics
Need help with your packaging project?
We’ve done the legwork to identify and vet experienced packaging and processing consultants you can contact directly for your next project. Decades of combined experience in packaging line engineering, machinery selection, package and materials development, and food processing operations.
See your advisor options now.
Is your packaging line built for connected packaging?
RFID, QR codes, and 2D barcodes are reshaping CPG operations. See how leading brands are adapting.
Read More
Downloads
