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New "smart and intelligent" packaging trade show

The first global event on smart and intelligent packaging will take place on January 28 and 29, 2003 at the Crowne Plaza Hotel, Miami, FL.

Organized by U.K.-based Pira International and IDTechEx (Cupertino, CA), the tradeshow will offer an opportunity to review current and future applications of intelligent and smart packaging for the retailer, brand owner, and consumer. Some of the driving technologies include electronic article surveillance, radio frequency identification, smart inks and diagnostics, and polymer and other laminar electronics such as the transparent electronic package.

An optional pre-conference briefing session will be held on January 27 to introduce the technologies and applications of intelligent packaging.

To register, call +44 1372 802243 or register online at www.piranet.com. For exhibitor information, contact Roz McGuinness at +44 1372 802227 or e-mail rozm@pira.co.uk.

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