Stauffer, international business development manager for PTI, will discuss package inspection technologies and non-destructive testing solutions on Monday, September 26, 2011 at 11:30 am as part of the Conference Sessions Program, sponsored by the Institute of Packaging Professionals (IOPP). His presentation will be followed by a Q & A with attendees. He will address the advantages and benefits of implementing a non-destructive inspection method, and he will focus specifically on the issues of cost, test method (subjectivity vs. hard data), sampling, and market trends.
"There is an increased awareness about the importance of package and seal integrity across all industries, particularly in pharmaceutical, food and medical device," says Oliver. "The packaging industry as a whole has recognized the demand for better, faster inspection methods that over time cost less because less waste is produced. Destructive test methods without a data stream are being replaced by systems that conform to a uniform standard, such as the ASTM. There is a growing concern that some of the traditional test methods that have had longevity in the packaging industry, many of which are destructive, are no longer reliable and produce a substantial amount of waste. Technologies that yield repeatable, quantifiable statistical test data are necessary to meet the needs of the packaging function today, and reliable testing that is beyond subjective results is needed to protect the manufactured product."
Michelle Wolf, marketing communications manager for PTI, says the presentation is a timely one for packaging professionals. "Attendees will learn about the challenges, opportunities, and latest technology solutions that exist for cost savings and increased efficiency,” says Wolf. “This is an excellent opportunity for quality assurance professionals to hear a presentation about the importance of non-destructive testing and how these technologies can assist companies to support sustainable business practices."
